General Package Information
Contains general information on Power Integrations' package design specifications, tape & reel information, and assembly information
- For information on moisture sensitivity level (MSL) packaging, see the Moisture Sensitivity Level (MSL) Packaging Information document
- For wave soldering recommendations of InSOP-24 and HSOP-28 packages, see applications note: AN-79 - Wave Soldering Guidelines for InSOP and HSOP Packages
