Bodo's Wide Bandgap Event 2024 - Munich
2024 December 3 - 4
Hilton Munich Airport
Terminalstraße Mitte 20
85356 München-Flughafen
Germany
Bodo's Wide Bandgap Event returns to Munich, bringing together innovators and industry experts from around the world to discuss the potential of wide bandgap power semiconductors. This conference serves as a pivotal platform for knowledge exchange, collaboration, and discovery in this rapidly evolving field.
Power Integrations CEO Balu Balakrishnan will participate in the opening roundtable on Day 1, and on Day 2, he will give a speech on the prospect of 1700 V-rated GaN to replace SiC in high-voltage applications above 1kV.