Electronica 2024
Messe München
Am Messeturm
81829 München
Germany
Stop by our booth and check out demos of the new product and our other popular solutions, which bring high efficiency, high reliability and a high level of integration to power conversion, motor driver and automotive applications.
Panel Discussion with Power Electronics News
Wide Bandgap Semiconductors - Tuesday, November 12
14.20 – 15.10
SiC & GaN Technologies: Exploring Advancements, Addressing Challenges
The global wide-bandgap environment has experienced growth and increasing industrial adoption. As technology continues to advance, businesses are amassing a vast assortment of devices that could provide advantages across numerous sectors, including industrial, automotive and consumer. The demand for high-performance, energy-efficient electronics is predicted to drive extraordinary growth in the WBG semiconductor market over the next 10 years.
Throughout the panel, speakers will discuss recent advancements in SiC and GaN technologies, sharing insights into applications, breakthroughs and innovative approaches shaping the future of power systems. These experts will shed light on how these developments are revolutionizing various sectors and driving efficiency, laying the groundwork for broader adoption and improved performance.
- Doug Bailey, Vice President of Marketing and Applications Engineering, Power Integrations
- Alex Lidow, CEO, EPC
- Guy Moxey, Vice President of Power Development for Wolfspeed
- Llew Vaughan-Edmunds, Senior Director, Product Management and Marketing (GaN, SiC), Navitas
Vice President of Marketing and Applications Engineering
Power Integrations
Featured Products
You can see more than 20 demos at the PI booth highlighting our latest innovations. Visit the product pages below to learn more about them before the show. Be sure to download the data sheets, product flyers and design example reports.
