会展活动

In our first webinar after the launch of the 1700 V PowiGaN-based InnoMux-2 flyback switcher ICs, we will discuss the significance of this technical achievement and the potential to replace high-cost silicon carbide (SiC) transistors with GaN devices in high-voltage applications.

Join the Global Automotive Electronics Summit in Shanghai. Technical Experts from Power Integrations will provide insights into our high efficiency power conversion and gate driver products that are automotive-qualified.

Bodo's Wide Bandgap Event returns to Munich, bringing together innovators and industry experts from around the world to discuss the potential of wide bandgap power semiconductors. This conference serves as a pivotal platform for knowledge exchange, collaboration, and discovery in this rapidly evolving field.

Join us in Shenzhen for the annual event. Technical experts from Power Integrations will bring insights to our high efficiency, high reliability products for power management, automotive and energy storage applications.