関連動画
PowiGaN for AI Data Centers: Unmatched Power Density and Reliability
Our VP of Product Development Roland Saint-Pierre explains why high-voltage PowiGaN technology offers the perfect solution for the new 800 VDC power systems for AI data centers.
HiperLCS-2 Chipset Introduction
The new HiperLCS-2 chipset (HiperLCS2-HB power device + HiperLCS2-SR isolation device) brings Power Integrations’ unique 600 V FREDFETs and magneto-inductive FluxLink technology to the LLC topology. The result is 98% efficiency and 40% component-count reduction in LLC resonant power converters up to 250 W.
Vice President of Marketing Doug Bailey explains.
アプリケーション
