eSIP Package Information

eSIP™ Package Enables Simpler, Lower Profile Power Supplies

Power Integrations' new eSIP package has the same low thermal impedance as the traditional TO-220, yet it's only half the height. This is ideal for slimmer electronic products such as LCD monitors, flat screen TVs, and set-top boxes.

Mounting Options

There are multiple low-cost mounting options for the eSIP package.

eSIP benefits:

Reduced height of package allows lower profile designs
Similar junction-to-case thermal impedance (θ_JC) as standard TO-220 package
Heat slug connected to Source to reduce EMI noise
Simple clip-mounted heatsink reduces manufacturing cost and improves repeatability

For specific information on package dimensions, please see Power Integrations' Package Information Document.

Figure 1 (right) illustrates the height difference between some of the packages shown in the above table. The L version of the eSIP, mounted with the adhesive mounting compound, has the lowest mounting height of 2.1 mm. The E version of the eSIP, mounted with the same compound, also has a very low profile (10.5 mm) when compared to the TO-220.

Figure 1: eSIP E and L packages with TO-220

Package Comparison

Package	Mounting Method	Minimum Mounted Height	Heatsink Potential
eSIP (L)	Liquid Adhesive Tape	2.1 mm 2.1 mm	Source
eSIP (H)	Extended Plastic Clip	10.5 mm	N/A
eSIP (E)	Liquid Adhesive Tape U-Clip Plastic Mini Clip Metal Clip Plastic Clip	10.5 mm 10.5 mm 15.1 mm 20 mm 20 mm 24 mm	Source
TO-220 (PI)	Liquid Adhesive Tape Screw	21 mm 21 mm 21 mm	Source
TO-220 (Standard)	Liquid Adhesive Tape Screw	21 mm 21 mm 21 mm	Drain

NOTE: The Power Integrations TO-220 and eSIP packages feature an exposed lead frame. This lead frame is connected to the SOURCE terminal of the MOSFET power device. When mounted, it is also connected to the heatsink. This ensures that the heatsink is connected to the DC(-) rail, which is also the electrically quiet node, and therefore does not lead to an increase in radiated EMI.