Application Notes

This application note provides basic guidelines on how to install the 1SP0335, 1SP0340 and 1SP0635 gate driver families on the IGBT modules. These recommendations are helpful to ensure proper mounting of the gate driver to the target IGBT module. It should be noted that it is recommended to use the exact target IGBT module. If issues arise due to use of different IGBT package, information in this note can help.

This application note compares the thermal performance of the triangular PCB configuration to the slotted linear PCB configuration with regards to case temperature rise above ambient temperature and temperature variations between adjacent BridgeSwitch devices.

This application note describes the motor control theory and inverter drive implementation for a single-phase (BLDC) motor drive using BridgeSwitch.

This application note provides answers to common BridgeSwitch technical questions.

Download the code library: Bridgeswitch Code Library for FAULT Status Communication Interface

This document offers guidelines for wave soldering design of InSOP-24 and HSOP-28 packages, particularly those without bottom exposed pads. Although IR/convection reflow is recommended for surface-mount attachment, both packages have been designed with wave soldering in mind when it is unavailable or not preferred. The document provides recommendations for solder pad layout, maximum spacing between solder pads, and solder thieves' orientation and design.

This application note discusses procedures to optimize use SCALE gate drivers with SiC MOSFET switches.

This document describes the design procedure for buck and buck-boost converters using the LinkSwitch-TN2 family of integrated off-line switchers.

Qspeed Family RoHS Compliant Soldering Considerations

Reverse Voltage Sharing of Series Rectifiers

Reverse Recovery Charge, Current and Time

Qspeed High Temperature Reverse Bias (HTRB) Reliability Testing

This Application Note highlights important points that must be considered when using SCALE™-2 driver cores as well as plug-and-play drivers. It complements Application Note AN-1101 /1/.

This Application Note describes the minimum requirements for preventing ESD during handling and assembly of all CONCEPT gate driver devices. CONCEPT products are sensitive to electrostatic discharge (ESD), as are MOSFETs and IGBT modules.

This application note will highlight important design rules and help to speed up the development time by showing detailed examples about how to design successfully IGBT drivers for industrial and traction applications. Considered SCALE-2 driver cores are: 2SC0108T, 2SC0435T, 2SC0650P and 1SC2060P.

This application note describes the calculation of the gate drive performance figures required for a given application. The values as derived from this application note serve as a base for selecting the most appropriate driver.

Parallel-connected IGBTs are conventionally driven by a common driver, with individual gate and emitter resistors for each IGBT. An alternative approach to driving parallel-connected IGBT modules is to use an individual driver for each module.

This application note describes the methodology for controlling multi-level converter topologies with SCALE-2 IGBT drivers in case of a fault. Multi-level converters use series-connected IGBTs to increase both the amplitude and switching frequency of the converter output voltage.

This application note describes the correct mechanical handling of CONCEPT drivers. It particularly points out that no excessive mechanical force should be applied to transformers.