์†”๋ฃจ์…˜ ์ฐพ๊ธฐ ๊ธฐ์ˆ  ์ง€์›
์‚ฌ๋ณธ์„ ์š”์ฒญํ•˜๋ ค๋ฉด์ด ์–‘์‹์„ ์ž‘์„ฑํ•˜์‹ญ์‹œ์˜ค.
 Impact of Printed Circuit Board Layout on Device Temperature in 3-Phase Inverters Using BridgeSwitch.
์ œ์ถœํ•˜๋ฉด Power Integrations๊ฐ€ ๊ฐœ์ธ ์ •๋ณด ๋ณดํ˜ธ ์ •์ฑ… ์— ๋”ฐ๋ผ ๋ฐ์ดํ„ฐ๋ฅผ ์‚ฌ์šฉํ•˜๊ณ  ์ฒ˜๋ฆฌํ•˜๋Š” ๋ฐ ๋™์˜ํ•˜๋Š” ๊ฒƒ์ž…๋‹ˆ๋‹ค.
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BridgeSwitch allows building compact, high-voltage brushless DC motors drives without having to use a physical heatsink. This document discusses techniques for optimizing the PCB layout, including device arrangement, inter device distance, and copper clad area, all of which play an important role in the thermal performance of the device.