PowerUP Virtual Expo 2024

The PowerUP Virtual Conference and Exhibition hosted by AspenCore is happening October 9-10. Visit Power Integrations' virtual booth for the latest news in AC-DC power conversion technologies, including our PowiGaN-based devices that set the industry standard for efficiency and reliability in gallium nitride-based power switching solutions.

(PD2) Technical Presentation about Power Electronics Design

2:40 to 3:00 PM CEST

(PD9) Panel Discussion: Ensuring Quality and Reliability in SiC & GaN Power Applications

5:30 to 6:15 PM CEST

This Panel Discussion is moderated by Maurizio Di Paolo Emilio, Editor-in-Chief, Power Electronics News

Wide-bandgap semiconductors have significantly contributed to the development of power systems, resulting in cost-effective component reductions. The use of WBG semiconductors in the most challenging power applications cannot be separated from a careful assessment of the reliability of the devices. The automotive market, for instance, is demanding solutions with small sizes and reduced weight to be used in electric vehicles. The purpose of this panel discussion is to examine the main challenges and solutions related to reliability that are intrinsic to WBG semiconductors like SiC and GaN. It will investigate the quality requirements associated with designs for a variety of mission-critical applications. Every panelist will offer valuable perspectives derived from their respective areas of expertise, including but not limited to material integrity, thermal management and long-term sustained performance.

Panelists:

• Doug Bailey, Vice President Marketing & Applications Engineering, Power Integrations
• Elif Balkas, VP of Research and Development for Materials, Wolfspeed
• Dilder Chowdhury, Director, Strategic Marketing for Power GaN technology, Nexperia
• John Tucker is the Power Market Segment Leader, Tektronix