Highly integrated DC-DC Converter ICs for Distributed Power Architectures

• Eliminates up to 50 external components–saves space, cost
• Integrates 220 V high frequency MOSFET, PWM control
• Lower cost plastic DIP surface mount (G package) and through-hole (P package) options for designs ≤35 W
• Thermally efficient TO-263-7C (R package) option for high power applications