PowerUP Virtual Expo 2024
Germany
The PowerUP Virtual Conference and Exhibition hosted by AspenCore is happening October 9-10. Visit Power Integrations' virtual booth for the latest news in AC-DC power conversion technologies, including our PowiGaN-based devices that set the industry standard for efficiency and reliability in gallium nitride-based power switching solutions.
(PD2A) Technical Presentation: Achieve High Efficiency, Half-Bridge Resonant and Synchronous Rectification in Compact Designs
October 9
2:40 to 3:00 PM CEST
Highly efficient power conversion using resonant topologies combined with low standby consumption has become increasingly important in industrial, EV, telecom and appliance applications. The HiperLCS™-2 IC family from Power Integrations provides a high efficiency DC-DC half-bridge resonant conversion chipset that eases the design and manufacture of LLC power supplies. HiperLCS-2 is a dual-chip solution which, reduces component count by up to 40% and reduces power dissipation to a point where heatsinks are not required for designs delivering up to 220 W. This presentation covers the features of HiperLCS-2 and addresses challenges in power conversion, such as load regulation across line voltages, stability, and efficiency across varying load conditions. In this presentation, we describe how to optimize efficiency while ensuring reliable operation in corner-case conditions and reduce no-load consumption to less than 50 mW.
Zeeshan Kabeer, Senior Product Marketing Engineer, Power Integrations
(PD9) Panel Discussion: Ensuring Quality and Reliability in SiC & GaN Power Applications
October 9
5:30 to 6:15 PM CEST
This Panel Discussion is moderated by Maurizio Di Paolo Emilio, Editor-in-Chief, Power Electronics News
Wide-bandgap semiconductors have significantly contributed to the development of power systems, resulting in cost-effective component reductions. The use of WBG semiconductors in the most challenging power applications cannot be separated from a careful assessment of the reliability of the devices. The automotive market, for instance, is demanding solutions with small sizes and reduced weight to be used in electric vehicles. The purpose of this panel discussion is to examine the main challenges and solutions related to reliability that are intrinsic to WBG semiconductors like SiC and GaN. It will investigate the quality requirements associated with designs for a variety of mission-critical applications. Every panelist will offer valuable perspectives derived from their respective areas of expertise, including but not limited to material integrity, thermal management and long-term sustained performance.
Panelists:
- Doug Bailey, Vice President Marketing & Applications Engineering, Power Integrations
- Elif Balkas, VP of Research and Development for Materials, Wolfspeed
- Dilder Chowdhury, Director, Strategic Marketing for Power GaN technology, Nexperia
- John Tucker is the Power Market Segment Leader, Tektronix
