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In this presentation during 2021 PCIM Europe Digital Days on May 5, PI Senior Product Marketing Manager Cristian IonescuCatrina introduces the MotorXpert software that enables designers using BridgeSwitch BLDC motor...

In this presentation during 2021 PCIM Europe Digital Days on May 5, PI Director of Business Development Peter Vaughan introduces the 900 V version of the InnoSwitch3-AQ flyback switcher IC...

During a panel discussion at the 2021 PCIM Europe Digital Days on May 5, PI Vice President of Marketing Doug Bailey explains how PowiGaN technology eliminates heatsinks while maintaining high...

In the first part of this 4-part video series, PI Vice President of Marketing Doug Bailey explains GaN technology and the new possibilities it brings to the power conversion industry.

In the second part of this 4-part video series, PI Vice President of Marketing Doug Bailey breaks down the improved system reliability and robustness realized by GaN technology.

In the third part of this 4-part video series, PI Vice President of Marketing Doug Bailey talks about which applications GaN technology is most suitable for.

In the fourth part of this 4-part video series, PI Vice President of Marketing Doug Bailey introduces PI products available with PowiGaN technology.

在2021年4月的线上直播中，资深技术培训经理Jason Yan讲解如何利用采取PowiGaN技术的PI产品，设计超小型的适配器电源，包含高度集成的InnoSwitch3系列反激式开关IC，以及大幅缩减电解电容体积的MinE-CAP IC。

Zero-voltage switching InnoSwitch4-CZ ICs with PowiGaN technology, paired with ClampZero active clamp solutions, usher in a new class of ultra-compact, ultra-efficient mobile charging devices.

Director of Applications Engineering David Chen (aka Mr. Green) breaks down the newest energy efficiency standards and power conversion technologies needed to comply.

In this full-length video, PI Vice President of Product Development Mike Matthews explains how MinE-CAP can reduce AC-DC converter size by 40% and work in conjunction with InnoSwitch3 switcher ICs...

在2020年11月的线上直播中，资深技术培训经理Jason Yan讲解PI的新型MinE-CAP IC，可将高压大容量电解电容的尺寸缩小一半，在不牺牲系统效率的前提下可以将适配器尺寸缩小最多40%。